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The summary data provided is a sampling of ERI's Salary Assessor® database. The average salary figures below are for base compensation. The Salary Assessor covers 5,700 job titles and 7,000 geographic locations. To download a demo of the Salary Assessor, please use the form to the right.
Job Description:
Tends automatic bonding machine that bonds gold or aluminum wire to integrated circuit dies to connect circuitry to package leads. A combination of up to one month of directly related training and/or experience is typically required for carrying out the responsibilities for this job.: Reviews schematic diagram or work order to determine bonding specifications. Turns dials to set bonding machine temperature controls and to regulate wire feeding mechanism. Mounts spool of wire onto holder and inserts wire end through guides, using tweezers. Positions semiconductor package into magazine of automatic feed mechanism, and observes package, using microscope or equipment display screen, to ensure connections to be bonded are aligned with bonding wire. Adjusts alignment as necessary. Activates machine that automatically bonds wire to specified connections on semiconductor package leads. Removes packages from bonding machine and places packages in work tray. May test tensile strength of bonded connections, using testing equipment. May locate connections and bond wire to connect circuitry of hybrid circuits, using precision-bonding machine. hide...show full description
Average Salary Data By Location
Updated: 06/18/2007
See salary survey data for these industries: Accounting Public & Private, Advertising & Marketing, Agriculture, Animal Care, Arts, Culture & Humanities Charities, Banking, Biotechnology, Call Centers, Customer & Other Business Services, Chemicals & Plastics, City & County Government, more...
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