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Wafer Polisher Salary
in Connecticut, United States

$38,067 (USD)

Average Salary


Average Hourly


Average Bonus

Salary Recap

The average pay for a Wafer Polisher is $38,067 a year and $18 an hour in Connecticut, United States. The average salary range for a Wafer Polisher is between $29,122 and $45,426. On average, a Bachelor's Degree is the highest level of education for a Wafer Polisher. This compensation analysis is based on salary survey data collected directly from employers and anonymous employees in Connecticut, United States.

Average Salary Chart

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Job Summary

  • Tends abrading machines that polish or lap surface of semiconductor wafers: reads work order to determine specifications.
  • Loads wafers or carriers containing wafers onto polishing or lapping machine.
  • Adjusts machine controls or loads programmed control media in machine to regulate pressure, time, and slurry flow.
  • Starts lapping machine that removes saw marks and reduces wafer thickness or starts polishing machine that polishes wafers.
  • Observes machine operation and listens to sounds of belts, cams, and abrading wheel to detect machine malfunctions.
  • Adjusts mechanisms or requests repairs as necessary.
  • Stops machine at prescribed time, removes wafers from machine, and rinses wafers with water to cool wafers and remove slurry.
  • Examines wafers for defects, and measures wafer thickness, using thickness gauge.
  • May clean wafers, using chemical solutions, water, or gases, to remove contaminants from wafer surface.
  • May mount wafers onto carriers.
  • May mix slurry.
  • May tend machine that rounds wafer edges and be designated edge-round tender.
  • May be designated according to machine tended as lapping machine tender.

Salary Potential

Estimated salary in 2024:
5 Year Change:
16 %



Skills data not available for this job

Wafer Polisher Job Listings for Connecticut, United States

No listings found